小米成立芯片平台部,秦牧云担任负责人!王化:手机产品部芯片平台部一直存在

新浪科技
15 Apr

新浪科技讯 4月15日下午消息,新浪科技独家获悉,小米日前内部宣布,在手机部产品部组织架构下成立芯片平台部,任命秦牧云担任芯片平台部负责人,向产品部总经理李俊汇报。资料显示,秦牧云此前曾在高通任职,担任高通产品市场高级总监,后加入小米。此时,也正值小米最新的自研SoC芯片对外亮相前的关键时刻。2017年,小米发布了自研SoC芯片澎湃S1,小米正式成为全球继三星、苹果、华为之后第四家同时拥有终端及...

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