慧与科技首席执行官在电话会议中表示，公司预测当前零部件与内存价格的上涨趋势将持续至2027年。这一判断基于全球供应链结构性压力及数字化转型带来的长期需求增长。半导体短缺、物流成本攀升及地缘政治因素共同推高了核心元器件采购成本，而云服务、人工智能等技术的蓬勃发展进一步加剧了内存产品的供需失衡。管理层指出，企业需通过优化库存策略、调整产品结构等方式应对成本压力，同时将部分成本转移至终端客户。
慧与科技首席执行官在电话会议中表示，公司预测当前零部件与内存价格的上涨趋势将持续至2027年。这一判断基于全球供应链结构性压力及数字化转型带来的长期需求增长。半导体短缺、物流成本攀升及地缘政治因素共同推高了核心元器件采购成本，而云服务、人工智能等技术的蓬勃发展进一步加剧了内存产品的供需失衡。管理层指出，企业需通过优化库存策略、调整产品结构等方式应对成本压力，同时将部分成本转移至终端客户。
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