异动解读|晶合集成盘中上涨3.33%,半导体板块持续反弹叠加港股通资金承接

行情直击
Aug 13

8月13日,晶合集成盘中上涨3.33%,报33.86港元/股,成交额291.5万港元。消息面上,半导体板块连续第三日集体走强,华虹宏力涨4.13%、澜起科技涨4.66%、兆易创新涨4.08%、中芯国际涨3.12%,行业系统性反弹延续。

此外,公司超额配售的10,886,900股H股于8月11日上市后持续站稳发行价32.30港元上方,新增供给消化顺利。公司已于8月7日被纳入港股通标的,叠加GIC、华勤技术等机构近期持续增持,为股价提供资金面支撑。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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