7月7日，壁仞科技盘中上涨3.01%，报49.14港元/股，成交额2.44亿港元。
消息面上，公司于7月5日公告拟按每股46.20港元配售1.53亿股新H股，较7月3日收市价51.30港元折让约9.94%，募资净额约70.38亿港元，资金主要用于加速下一代GPGPU产品商业化及生产（约60%）、尖端技术研发（约20%）等。受配售折价及约6.27%股本摊薄影响，公司股价于7月6日大跌9.36%。当前股价反弹，市场对配售消息的短期冲击有所消化，且配售价46.20港元对当前股价形成一定支撑。
壁仞科技是一家主要从事通用图形处理器（GPGPU）芯片开发及提供基于GPGPU的智能计算解决方案的公司，产品包括BR106、BR166及BR110芯片，主要在国内市场开展业务。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.