On May 22, ASMPT rose 3.2% in regular trading, trading at HKD 181.3/share with trading volume of approximately HKD 42.48 million, extending its recent upward trend.

On the news front, the company recently completed the sale of its U.S. subsidiary NEXX to Applied Materials for USD 120 million in cash, divesting its lower-margin front-end deposition business to sharpen its strategic focus on backend packaging. Additionally, Q1 adjusted profit reached HKD 335 million, surging 193.5% year-over-year, while revenue of HKD 3.97 billion grew 32.0% year-over-year, both exceeding market expectations. Meanwhile, the company's TCB equipment has secured an SK Hynix order worth approximately KRW 30 billion for HBM4 mass production, with equipment unit prices nearly doubling compared to prior generations and the order book already filled through Q2 of next year. Institutional analysts highlighted that AI demand is expanding from advanced packaging into mainstream backend processes, with silicon photonics and CoPoS expected to unlock long-term growth potential.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)