异动解读|应用材料盘中下跌3.34%,长端美债收益率冲高压制估值,半导体设备板块集体承压

行情直击
Aug 19

8月19日,应用材料盘中下跌3.34%,报495.07美元/股,成交额5.63亿美元。半导体设备板块集体走弱,拉姆研究跌3.98%,泰瑞达跌5.58%,科磊跌3.07%,阿斯麦跌1.78%,AXT Inc跌10.02%,板块共振加剧公司回调幅度。

消息面上,长端美债收益率持续冲高对高成长科技股估值形成压制,费城半导体指数重挫近5%,资金从AI动量板块流出转向防御资产。公司此前公布Q3财报营收91.2亿美元同比增25%、Q4营收指引中值102.5亿美元均超预期,财报后多家投行密集上调目标价,但在股价年内已翻倍的背景下,市场对利好兑现后的获利盘压力持续存在,叠加板块系统性抛压主导当前回调。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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