据最新供应链消息透露，科技巨头苹果公司已制定明确采购计划，预计到2026年将向台积电位于美国亚利桑那州的晶圆厂订购超过1亿颗先进制程芯片。这一规模远超市场预期，凸显苹果对供应链多元化和技术领先性的战略布局。
此次大规模采购涉及台积电最先进的制程技术，预计将主要用于苹果未来推出的iPhone、Mac系列等核心产品。亚利桑那工厂作为台积电在海外的重要生产基地，其产能保障成为苹果长期合作的关键支点。
业内人士分析指出，超百亿颗芯片的采购量不仅巩固了台积电与苹果的深度绑定关系，更将对全球半导体产业格局产生深远影响。这一合作模式或将推动更多科技企业效仿，加速高端芯片制造向多元化地域分布转型。
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