The highly anticipated third campus of PCB Bancorp in Shenzhen has officially commenced construction at Yanluo Bay Area Core Chip City in Bao'an District. As one of Shenzhen's key major industrial projects for 2026, this groundbreaking ceremony signals a significant step forward for the city in securing a competitive edge in AI computing hardware manufacturing.
The project, strategically located in the Yanluo Bay Area Core Chip City of Bao'an, encompasses a total construction area of approximately 399,000 square meters with a total investment nearing the 10-billion-yuan mark. The campus will concentrate on core supporting products for AI computing hardware and intelligent terminals, with the goal of establishing a modern AI manufacturing benchmark zone that integrates high-end PCB research and development, intelligent production, and digital operations, fully catering to the massive computing power demands of the AI era.
In terms of industrial layout, this new campus is not an isolated entity; it is designed to develop in tandem with PCB Bancorp's existing first and second campuses, forming a powerful collaborative manufacturing matrix. This clustered and interconnected development approach is expected to effectively bridge the capacity gap in high-end electronic components within the region, constructing a more complete ecosystem for high-end printed circuit board manufacturing.
As a global leader in the PCB industry, PCB Bancorp's substantial reinvestment in Shenzhen represents a strategic move aligned with the global expansion of capital expenditure in AI data centers. With the rapid growth of AI servers and high-speed optical modules as core hardware carriers for computing networks, the completion of this new campus will precisely meet the incremental demands of upstream and downstream computing hardware, solidifying the company's central position in the global supply chain.
The successful launch of this project also underscores the determination of Shenzhen's Bao'an District to build a world-class electronic information industry cluster. The Yanluo Bay Area Core Chip City is intensively unleashing its industrial potential, fully embracing its mission as the primary hub for the PCB industry in Bao'an. The relocation of the third campus here will further refine Shenzhen's complete computing power industry chain, spanning from chip packaging and PCB manufacturing to AI complete machine production.
Looking ahead, as this multi-billion-yuan computing infrastructure gradually becomes operational, Shenzhen is poised to strengthen its core advantages in artificial intelligence and high-end electronics manufacturing. This development will not only attract a cluster of upstream and downstream supporting industries, such as precision equipment and electronic chemicals, but will also provide solid foundational support for the Guangdong-Hong Kong-Macao Greater Bay Area in cultivating new quality productive forces and accelerating its upgrade toward intelligence and high-end sophistication.