Southern 2x Long Samsung Electronics (07747) surged more than 6% in Thursday trading, reaching 83.86 Hong Kong dollars at the time of writing, with a trading volume of 181 million Hong Kong dollars.

Market media reports indicate that Samsung Electronics Co., Ltd. plans to increase outsourced cleaning volumes for "glass substrates," an essential component in the HBM production process, from 20,000 sheets per month this year to 50,000 sheets per month next year—a 2.5-fold jump. Industry insiders suggest this signals that actual output of HBM4 and HBM4E is expected to at least double next year compared to this year.

Meanwhile, Samsung's overall monthly HBM wafer input is forecast to expand from approximately 180,000 wafers this year to around 250,000 wafers next year, marking a nearly 40% increase. It is worth noting that this production expansion is creating significant momentum for upstream supply chain players. Glass substrate outsourcing cleaning volumes are slated to grow from 10,000 sheets to 50,000 sheets per month within two years, a five-fold increase that correspondingly boosts order volumes for related suppliers.

From an industry trend perspective, the continuous increase in HBM stacking layers—advancing from early 8-layer and 12-layer configurations to higher counts—is amplifying the bottleneck effect of wafer thinning and support processes across the entire manufacturing workflow.