7月9日，日月光半导体盘中上涨8.68%，报43.38美元/股，成交额3557.25万美元。
消息面上，公司公布6月营收数据，实现合并净收入657.83亿新台币，同比增长32.9%；其中封装、测试及材料（ATM）业务收入同比大增41.8%至434.85亿新台币，显著超出市场预期。第二季度累计合并净收入达1910.64亿新台币，同比增长26.7%。此外，公司于7月1日宣布先进封装报价上调逾20%，涵盖CoWoS及FoCoS等品类，美银此前上调公司估值预期，认为服务器CPU相关封测市场规模有望从19亿美元增至96亿美元。当日半导体板块整体回暖，美光科技涨6.43%、英特尔涨4.05%。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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