6月11日，广合科技盘中下跌3.17%，报161.7港元/股，成交额3793.29万港元。
消息面上，覆铜板厂商自6月初起陆续发出三季度涨价通知，提价幅度普遍在10%至15%之间，叠加CCL价格较年初累计上涨约40%，下游PCB制造商成本传导压力持续加大。当日行业内上游建滔积层板涨3.51%，而下游胜宏科技跌0.22%，上下游分化格局延续，市场对PCB制造商盈利前景的担忧仍在发酵。该公司主营多高层印制电路板的研发、生产与销售，产品应用于服务器、消费电子、通信及汽车电子等领域。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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