May concluded for the A-share market on Friday, with technology stocks such as semiconductors and chips leading the decline. However, technology stocks in Japan, South Korea, and the U.S. market performed strongly on the same day, indicating sustained investor interest in the sector.
Next week, positive catalysts are expected for the NVIDIA supply chain, including NVIDIA's GTC Taipei 2026 conference. In semiconductor materials, Japanese supplier Sumitomo Bakelite has raised prices for epoxy molding compounds used in semiconductor packaging by 10% to 20%.
Positive developments are anticipated for the A-share NVIDIA supply chain next week. Although semiconductor and chip stocks in the A-share market fell sharply on Friday, overseas markets remained active. In the U.S. stock market, Dell Technologies' stock price surged 32% in a single day, with Microsoft, Broadcom, Micron Technology, and Oracle also posting significant gains. The top ten companies by market capitalization in the U.S. are all technology stocks.
Next week, a key catalyst for the A-share NVIDIA supply chain will be the GTC Taipei 2026 conference hosted by NVIDIA, often referred to as the "global AI enabler." CEO Jensen Huang will deliver a keynote speech, unveiling breakthrough technological advancements driving the next generation of AI. Additionally, the COMPUTEX 2026 exhibition (Taipei Computer Show) will be held in Taipei from June 1 to 5.
Market expectations suggest that NVIDIA's focus at the COMPUTEX exhibition may center on data center products, such as the Vera Rubin platform and Vera CPU. Previously, according to NVIDIA's official website, during a dinner with Quanta Computer executives on May 27, Jensen Huang hinted at an upcoming mysterious new product but did not specify whether it would be officially launched at the GTC Taipei conference or COMPUTEX.
Regarding the NVIDIA supply chain, market analysts note that stock prices of companies related to copper clad laminates, optical modules, indium phosphide, diamond heat dissipation, and solid-state transformers have already surged significantly. Investors may consider researching companies involved in M10 materials for copper clad laminates, such as those producing electronic-grade PTFE (polytetrafluoroethylene).
Some research indicates that M10 materials are still based on hydrocarbon resins and are currently in the testing phase. Potential formulations include hydrocarbon resin combined with BCB (benzocyclobutene), hydrocarbon resin with PTFE (polytetrafluoroethylene), or hydrocarbon resin with BT resin. Public information shows that PTFE, as the polymer material with the lowest dielectric constant discovered to date, has a dielectric loss value below 0.002, demonstrating excellent dielectric properties in copper clad laminate applications.