Resideo公布ADI无抵押高级票据定价,为计划分拆铺路

投资观察
Jun 17

6月16日——Resideo Technologies Inc.宣布,其旗下ADI部门已为即将进行的分拆交易,完成了总额4亿美元、于2034年到期的无抵押高级票据的定价工作。此举标志着公司推进分拆计划的关键一步。

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