6月18日，盛美半导体夜盘上涨5.1%，报101.1美元/股，成交额32.68万美元。半导体设备板块延续强势，行业个股普遍走强，应用材料涨4.23%，拉姆研究涨3.36%，科磊涨3.23%，阿斯麦涨2.71%，泰瑞达涨2.57%。
消息面上，SEMI此前发布报告显示，一季度全球半导体设备出货金额同比增长14%，达365.5亿美元，环比增长1%，创下纪录季度销售额。创纪录表现由持续的AI相关投资驱动，包括支持先进逻辑芯片、DRAM和先进封装的产能扩张及技术升级。盛美半导体作为湿法清洗与电镀设备龙头，高温SPM清洗技术实现突破，可适配GAA、HBM等高端算力芯片量产，海内外先进封装设备订单持续落地，业绩确定性较强，板块景气持续验证下资金关注度提升。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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