新思科技在Safe Forum 2026上,基于三星最新制程推进AI与多芯片设计的功耗与性能优化

美股速递
May 29

在2026年安全论坛上,新思科技展示了其在人工智能及多芯片系统设计领域的最新突破。该公司宣布,其解决方案已成功适配三星代工厂最先进的制程工艺,旨在显著提升芯片的能效比与整体性能表现。

这一进展意味着,设计人员将能够利用新思科技的工具链,在三星的前沿制造节点上,更高效地开发面向人工智能应用和复杂多芯片封装的高性能集成电路。通过优化功耗与性能的平衡,新思科技致力于帮助客户应对日益增长的计算需求与能效挑战。

此次技术推进,突显了新思科技在电子设计自动化领域的持续创新能力,以及其与领先代工厂深化合作,共同推动半导体产业发展的战略布局。

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