消息面上,摩根大通上调晶圆制造设备市场增长预测,将2026年增速从28%上调至31%(对应市场规模1630亿美元),2027年从29%上调至38%(2250亿美元),三年复合增长率达28%。上调主因是DRAM和台积电资本开支强于预期,叠加美国前四大云厂商资本开支复合增长率预计达58%,资金多流向AI基础设施,拉动先进制程与封装设备需求,为半导体设备板块提供基本面支撑。此前科磊因瑞银下调目标价至200美元及中美贸易摩擦升温,9月14日单日跌幅达7.15%。板块方面,半导体设备行业整体走强,Aehr Test Systems涨4.88%、AXT Inc涨4.70%、拉姆研究涨1.94%、阿斯麦涨1.54%、应用材料涨1.44%。
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