Shenzhen Xunce Technology Co., Ltd. (XUNCE, 03317) has completed two concurrent capital-raising transactions under its general mandate, bolstering resources for an accelerated rollout of enterprise-scale AI infrastructure.

The company placed 7.28 million new H shares at HK$107.70 each, generating gross proceeds of approximately HK$784 million and net proceeds of about HK$771 million after fees. The new shares represent 2.21% of the enlarged share capital, lifting the total issued shares to 329.98 million. Public float expanded from 61.08% to 61.94%. No placee became a substantial shareholder.

Separately, XUNCE issued RMB1.36 billion (about US$200 million) of U.S.-dollar-settled zero-coupon convertible bonds due 2027. Net proceeds total roughly US$196 million. The bonds are expected to start trading on the Hong Kong Stock Exchange on or around 13 July 2026, and the exchange has approved the listing of up to 12.69 million conversion shares at an initial conversion price of HK$123.86.

Proceeds from both the placement and the bond issue will fund the build-out of XUNCE’s “full-chain AI infrastructure,” including its TokenOS-based architecture for large-scale data tokenisation, real-time computing and AI model deployment. The company highlighted partnerships with Beijing International Data Exchange, MetaX, Iluvatar CoreX, Biren Technology, PATEO CONNECT and Saimo Technology to advance cross-industry commercialisation of these capabilities.

If the bonds are fully converted, XUNCE’s total share count would rise to 342.66 million, and H shares held by the public would increase to 63.35% of the enlarged capital.

Following the placement, the board has updated the company’s Articles of Association to reflect the new registered capital of RMB329.98 million and will complete the requisite CSRC filings.