Shenzhen Launches Nation's First Bond Market "Technology Board," Issuance Scale Exceeds 400 Billion Yuan

Deep News
Jan 09

On January 9, 2026, it was learned from the Shenzhen Branch of the People's Bank of China and the Shenzhen Sub-bureau of the State Administration of Foreign Exchange that a comprehensive, cross-border, and full-lifecycle sci-tech financial service system has been established. Firstly, Shenzhen took the lead in launching the national bond market's Technology Board, achieving the "first batch of issuances," the "first batch of registrations," and the "first single risk-sharing instrument." In 2025, the total scale of sci-tech innovation bonds issued by non-financial enterprises reached 44.15 billion yuan, ranking second among all cities in the country.

Secondly, three models—"Soaring Loan," "Tech Startup Connect," and "Sci-Tech Convergence"—have been promoted nationwide, assisting over 5,100 early-stage and growth-stage technology companies in Shenzhen to obtain loans exceeding 16 billion yuan.

Thirdly, the sci-tech innovation and technological transformation relending program supported 2,843 tech enterprises and 122 technological transformation projects, issuing loans totaling 61.1 billion yuan, which ranks third nationally among cities.

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