异动解读|应用材料盘前下跌3.85%,大空头伯里做空半导体板块持续发酵

行情直击
Jul 28

7月28日,应用材料盘前下跌3.85%,报493.72美元/股,成交额343.52万美元。消息面上,有大空头之称的迈克尔·伯里此前公开披露对应用材料的空头仓位,并持续加码做空AI及半导体板块,预计相关芯片股整体可能出现约30%的调整。受空头情绪压制,半导体设备板块整体承压,行业个股中艾马克技术公司跌9.04%、拉姆研究跌4.16%、阿斯麦跌3.65%、科磊跌3.59%、泰瑞达跌3.49%。值得关注的是,此前汇丰、花旗、瑞银密集上调应用材料目标价至683至705美元区间,分析师平均目标价为641.61美元,但短期空头情绪仍主导市场走势。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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