异动解读|广合科技盘中上涨3.09%,PCB板块持续回暖叠加中报业绩支撑

行情直击
Aug 21

8月21日,广合科技盘中上涨3.09%,报126.8港元/股,成交额2225.73万港元。此前该股连续回调,近日电子元件板块整体回暖,建滔集团涨4.31%,建滔积层板涨2.89%,胜宏科技涨2.29%。

基本面方面,公司上半年营收43.88亿元,同比增长80.98%;归母净利润9.56亿元,同比增长94.39%,算力场景PCB收入占比83.6%。高盛近期将全球AI PCB市场规模预测上调35%,富国基金、摩根士丹利等机构持续增持,基本面支撑较强。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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