2月11日，ASMPT涨超7%，获主要客户订购超细间距TCB AOR芯片对晶圆设备。
消息面上，ASMPT近日宣布，成功获得某主要客户的新订单，将提供两台搭载专有等离子主动氧化物去除(AOR)技术的超细间距热压接(TCB)设备，用于芯片到晶圆(C2W)应用。这项成果进一步巩固了ASMPT于先进封装市场的技术领导地位。
值得注意的是，中芯国际高管在业绩说明会上表示，2025年公司资本开支为81亿美元，高于年初预期，主要是因为应对客户强劲需求、外部环境变化以及设备交付时间加长。在外部环境无重大变化的前提下，中芯国际给出的2026年指引为：销售收入增幅高于可比同业的平均值，资本开支与2025年相比大致持平。
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