7月10日，晶合集成(02249)H股正式登陆港交所主板，盘中上涨12.88%，报36.34港元，成交额7.76亿港元。
消息面上，晶合集成H股以招股价上限32.3港元定价，全球发售2.16亿股，募资净额约67.79亿港元。此次IPO获市场热烈追捧，香港公开发售获344.26倍超额认购，国际发售获14.62倍认购，孖展超购234.65倍。公司引入集创、奇瑞汽车香港、高毅等20名基石投资者。晶合集成为全球第九大、中国大陆第三大晶圆代工企业，专注12英寸纯晶圆代工，制程覆盖150nm至40nm并推进28nm，募资逾半将用于22nm技术平台研发。
公司主要从事12英寸晶圆代工业务，致力于研发及应用行业先进工艺，主要产品涵盖显示驱动芯片、CMOS图像传感器芯片、电源管理芯片、微控制器芯片及逻辑芯片等。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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