异动解读|晶合集成盘中上涨3.06%,中期业绩发布在即叠加半导体板块走强

行情直击
Aug 17

8月17日,晶合集成盘中上涨3.06%,报35.7港元/股,成交额2376.22万港元。

消息面上,公司将于8月24日发布截至6月30日止中期业绩,市场一致预期本季度营收33.56亿元,同比增长23.05%,EPS为0.12元,同比增长50.00%,业绩窗口临近催化市场情绪。同业方面,中芯国际当日涨4.24%、华虹宏力涨5.45%,半导体板块整体走强形成联动效应。此外,华勤技术此前增持公司股份至11.03%、GIC增持至5.30%,机构资金持续入场为股价提供支撑。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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