Shenzhen Kaifa Technology Co.,Ltd. has announced that its wholly-owned subsidiary, Peatton Technology (Shenzhen) Co., Ltd., and its controlling subsidiary, Hefei Peatton Storage Technology Co., Ltd., plan to implement a project to expand high-end memory chip packaging and testing capacity. The total planned investment for the project is approximately 1.47 billion yuan. The funds will be used for the procurement of equipment such as high-end chip testers and high-precision wafer grinding integrated machines, as well as for factory renovation and supporting utility facilities. Upon completion and reaching full production, the Shenzhen Peatton facility is expected to increase its monthly packaging capacity by 5 million wafer dies and its testing capacity by 8 million chips. The Hefei Peatton Storage facility is projected to add a monthly packaging capacity of 28.8 million wafer dies. By executing this capacity expansion project, the company aims to proactively respond to growing customer demand for incremental packaging and testing services, enhance customer loyalty, further strengthen its profitability, consolidate its market position in the semiconductor packaging and testing business, and thereby achieve steady growth in this segment.