5月29日，广合科技盘中上涨6%，报197.5港元/股，成交额6623.17万港元。
消息面上，多重利好共振推动股价走强。公司此前披露预计三季度后PCIe6.0将正式进入量产，在全球服务器制造TOP10中已有8家为其客户，在手订单充裕。此外，PCB板块近期持续活跃，摩根士丹利研报显示英伟达Rubin平台单机架PCB价值从3.51万美元提升至11.67万美元，涨幅达233%，高层数PCB需求显著扩容。公司已完成对子公司黄石广合1亿元增资的工商变更登记，注册资本增至7.8亿元，进一步强化产能扩张基础。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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