9月21日，应用材料盘中上涨3.21%，报458.03美元/股，成交额7.33亿美元。
消息面上，应用材料此前在SEMICON India大会上宣布未来十年在印度投资50亿美元，涵盖班加罗尔140英亩研发园区建设、供应链产能扩张及人才培养，并计划到2035年将印度供应链产能扩大十倍。市场将此举视为分散地缘风险、优化全球供应链布局的重要信号，投资计划持续发酵提振板块情绪。半导体设备板块集体走强，科磊涨3.03%、拉姆研究涨2.09%、阿斯麦涨1.0%。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.