SICC (02631) rose more than 5% in afternoon trading. At the time of writing, the stock was up 4.6% to HK$58, with a turnover of HK$77.6832 million. On April 16, Taiwan Semiconductor Manufacturing (TSM) released its first-quarter 2026 financial report, showing a net profit of NT$572.5 billion, a year-on-year increase of 58%, approximately 6% higher than the estimated NT$542.4 billion. Revenue reached NT$11.34 trillion, up 35% year-on-year, surpassing the estimated NT$11.2 trillion. TSMC announced first-quarter capital expenditure of US$11.1 billion. Guojin Securities previously noted that TSMC plans to introduce 5.5x reticle size CoWoS in 2026 and achieve 9.5x in 2027, supporting 12-layer HBM and multi-chip integration, making advanced packaging a key variable for AI computing power. The ultra-large size introduces new bottlenecks in thermal management and warpage control. Silicon carbide (SIC) materials, with their high thermal conductivity and low coefficient of thermal expansion, are expected to be gradually adopted as thermal diffusion layers and structural support layers, addressing thermal-mechanical coupling challenges.