Alpha HPA有限公司（ASX: A4N）已成功将一份意向书转化为具有法律约束力的供应合同。该合同锁定其向一位韩国客户供应用于高带宽内存（HBM）芯片封装的特种热界面材料。
这份具有约束力的合同涵盖了2026财年（CY2026）的供应量，标志着公司在高端电子材料市场取得了重要进展。热界面材料是HBM等先进芯片封装中的关键组件，对于管理芯片运行过程中产生的热量、确保其性能和可靠性至关重要。
此次与韩国客户的合作，不仅为Alpha HPA带来了确定的未来收入，也进一步验证了其产品在技术要求严苛的半导体供应链中的竞争力和市场接受度。
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