6月8日，台积电盘中上涨3.01%，报430.9美元/股，成交额15.44亿美元。
消息面上，台积电董事长兼总裁魏哲家在6月4日股东会上透露，基于玻璃基板的CoPoS先进封装技术已正式进入试点线运行阶段，预计2-3年内产能将显著提升。该技术采用方形玻璃面板替代传统硅中介层，旨在支持更大尺寸AI与HPC芯片封装需求，英伟达为首批客户。此外，魏哲家重申全年营收增速将超30%，并暗示下半年3纳米制程报价将上调最高15%，AI芯片需求持续强劲。半导体板块同步走强，美光科技涨8.91%，英特尔涨10.49%，迈威尔科技涨9.4%。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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