Hengong Precision Plans Up to 810 Million Yuan Convertible Bond Offering
Stock News
Yesterday
Hengong Precision Equipment Co.,Ltd. (301261.SZ) has announced a plan to issue convertible corporate bonds to unspecified investors, aiming to raise a total of no more than RMB 810 million (including the principal amount).
The net proceeds from the offering, after deducting issuance expenses, are earmarked for several key initiatives. These include a project for manufacturing embodied intelligent robot bodies, a pilot base for embodied intelligent robots along with a Shanghai research and development center, an expansion project for high-end equipment components, a new materials expansion project for high-end components, and supplementing working capital.
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