中国计划在未来1-2年内将相对先进芯片产量提升至10万片晶圆

美股速递
Feb 25

据消息人士透露,中国正加速推进半导体产业升级,目标是在未来一到两年内将相对先进制程芯片的月产能提升至10万片晶圆。这一战略规划凸显了中国在高端芯片制造领域实现自给自足的决心。

目前国内主要晶圆代工厂正通过技术突破和设备优化持续提升产能。随着全球半导体产业格局变化,中国正抓住机遇窗口,着力构建完整的芯片供应链体系。

行业观察人士指出,若该目标顺利实现,将显著增强中国在28纳米等成熟制程芯片领域的全球市场话语权,并为更先进制程的研发奠定坚实基础。这一产能扩张计划预计将带动相关设备、材料产业链的协同发展。

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