CHENGDU EXPWAY (01785) Plans to Issue Up to RMB500 Million Corporate Bonds

Stock News
Dec 10

CHENGDU EXPWAY (01785) announced its plan to issue the first tranche of its 2025 Rural Revitalization Corporate Bonds (Chengdu-Chongqing Economic Circle) targeting professional investors. The issuance period is set from December 12 to December 15, 2025, with a total offering size not exceeding RMB500 million (inclusive). The bonds will have a 5-year maturity, a par value of RMB100, and will be issued at par. Proceeds from the bond issuance will be allocated for equity investments.

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