合肥晶合集成电路股份有限公司（02249）7月7日公告称，公司已完成在香港的英文名称变更程序。香港公司注册处处长于2026年7月6日向公司发出《注册非香港公司变更名称注册证明书》，确认公司英文名称由“Nexchip Semiconductor (China) Limited”变更为“Nexchip Semiconductor Corporation”。
公司于2026年6月8日向香港公司注册处提交名称变更申请，并在2026年6月30日的招股章程中披露相关信息。
公告指出，此次英文名称更改不影响股东任何权利。带有原英文名称的全部H股股票将继续有效，可用于买卖、结算、交付及登记，公司亦不会安排免费换发印有新英文名称的股票。
英文及中文股份简称分别维持为“NEXCHIP”及“晶合集成”，H股股份代号仍为02249。
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