7月15日，晶合集成H股盘中上涨3.39%，报30.52港元，成交额783.49万港元。该股自7月10日以32.30港元发行价上市后持续走弱，前一交易日曾跌至28.94港元，今日出现超跌反弹。
消息面上，7月14日晶合集成出现大额仓位异动，转仓市值总计4.79亿港元，占已发行H股比例7.39%，其中364.51万股转入摩根士丹利香港证券，显示机构资金正在重新布局。此外，股东华勤技术此前已在上市首日以均价34.65港元增持162.82万股H股，合计持股比例回升至10%，表达对公司长期价值的认可。当前半导体板块整体走强，中芯国际涨2.87%、兆易创新涨4.86%、华虹宏力涨2.80%，板块联动亦对股价形成支撑。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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