7月15日，Tower半导体盘中上涨5.22%，报268.82美元/股，成交额1.34亿美元，延续前一交易日强势表现。
消息面上，公司近日宣布将投资约30亿美元扩建其位于日本的300毫米晶圆制造厂，大幅提升硅光子、硅锗及先进封装产能，该计划获得日本政府约10亿美元补助支持。同时公司将2028年营收目标从28亿美元上调至36亿美元，净利润目标从7.5亿美元上调至12亿美元，上调幅度分别达29%和60%。此次扩产旨在满足人工智能和数据中心对光互连技术日益增长的需求，Wedbush认为硅光子扩产将打开AI基础设施增长空间。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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