异动解读|应用材料盘前上涨3.94%,半导体设备板块延续超跌反弹修复走势

行情直击
Jul 09

7月9日,应用材料盘前上涨3.94%,报591.18美元/股,成交额1059.45万美元。此前该股因知名空头伯里公开做空、CEO Gary Dickerson累计减持78,321股套现超5400万美元,叠加三星业绩利好出尽引发全球半导体板块抛售,连续多个交易日累计大幅回落。

消息面上,半导体设备板块整体延续超跌修复行情,同板块个股中拉姆研究涨3.56%、科磊涨3.48%、泰瑞达涨3.15%、阿斯麦涨1.5%。此外,高盛此前将应用材料目标价上调至645美元,摩根士丹利上调至647美元,并指出晶圆厂设备市场增长预期显著提升,为股价反弹提供基本面支撑。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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