异动解读|日月光半导体夜盘上涨3.2%,先进封装量价齐升叠加台积电订单外溢提振

行情直击
Aug 20

8月20日,日月光半导体夜盘上涨3.2%,报36.8美元/股,成交额101.28万美元。在经历前一交易日盘中大幅回调后,股价出现修复性反弹。

消息面上,多重行业利好共振:台积电先进封装CoWoS产能供不应求,部分后段订单外溢,日月光投控作为核心供应链有望直接受益;中信证券研报指出,全球封测厂Q2收入同比增长26%-36%,日月光投控稼动率已接近满载,全年资本开支上调至约105亿美元,其中70%投向尖端先进封装。此外,公司Q2每股收益0.29美元,大幅超出市场预期的0.17美元,7月营收同比增长43%,基本面持续向好。当前半导体板块整体回暖,美光科技涨1.43%、迈威尔科技涨1.67%、博通涨1.38%,板块联动效应明显。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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