7月6日，应用材料盘前上涨3.43%，报624.96美元/股，成交额417.95万美元。消息面上，半导体设备板块整体出现超跌修复行情。此前该股因知名空头伯里公开做空叠加CEO Gary Dickerson大额减持约78,321股（套现约5500万美元），连续两个交易日累计大跌约15%，股价从历史高点大幅回落。
产业资本层面，美光近日启动广岛工厂HBM扩建工程，三星与SK海力士长期扩产计划持续推进，半导体设备端实际需求逻辑并未改变。同板块个股同步走强，科磊涨4.04%、阿斯麦涨3.86%、泰瑞达涨3.73%、拉姆研究涨3.64%。多家投行仍维持对该股750至900美元的目标价区间，市场在急跌后出现技术性买盘回补。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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