天弘科技与美国超微公司携手推出"Helios"机架级AI平台,共拓人工智能新纪元

美股速递
Mar 16

全球领先的技术解决方案供应商天弘科技与高性能计算巨头美国超微公司正式宣布达成战略合作,双方将共同推进人工智能技术的创新发展。此次合作的核心成果是联合推出名为"Helios"的机架级人工智能平台,该平台旨在为下一代AI应用提供强大的计算支持。

"Helios"平台融合了天弘科技在硬件集成与制造领域的专业优势,以及美国超微公司在先进处理器技术方面的深厚积累。这一创新解决方案将显著提升AI工作负载的处理效率,为企业在机器学习、深度学习等前沿领域的发展注入新动力。

两家公司表示,此次合作标志着人工智能基础设施建设迈入新阶段。通过强强联合,双方将共同推动AI技术在各行各业的规模化应用,助力客户应对日益复杂的计算挑战,开启智能计算的新篇章。

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