01 Stock Market

As of Feb 23, the U.S. major indexes closed as follows:

The U.S. major indexes closed as follows: Dow Jones up 0.47% at 49625.97; S&P 500 up 0.69% at 6909.51; NASDAQ up 0.90% at 22886.07. The session showed broad strength across large-cap technology and semiconductor names, helping the growth-heavy NASDAQ outperform. Investors continued to rotate toward AI-enabled hardware and software platforms, while index-level ETFs tracked the move higher.

Semiconductors and mega-cap tech showed notable moves. NVDA up 1.02% at $189.82; MSFT down 0.31% at $397.23; TSLA up 0.03% at $411.82; MU up 2.59% at $428.17; SNDK up 4.65% at $649.97; AGQ up 15.78% at $158.52; GOOG up 3.74% at $314.90; SOXL up 2.88% at $67.11; INTC down 1.14% at $44.11; SLV up 7.90% at $76.62; AMZN up 2.56% at $210.11; AAPL up 1.54% at $264.58; AMD down 1.58% at $200.15; PLTR up 0.26% at $135.24; QQQ up 0.88% at $608.81; SPY up 0.72% at $689.43; OPEN up 7.53% at $5.00; ORCL down 5.40% at $148.08; PDD up 2.93% at $104.94; COIN up 3.26% at $171.35; ONDS down 11.94% at $10.03; GOOGL up 4.01% at $314.98; WDC up 0.30% at $285.52; GLD up 1.97% at $468.62; TSM up 2.82% at $370.54.

Precious-metals-linked ETFs spiked while select tech laggards declined. Leveraged silver exposure via AGQ surged alongside gains in SLV, and broad gold exposure in GLD advanced, signaling strong interest in metals. In software, ORCL declined, while dual-share GOOG/GOOGL climbed as search and cloud catalysts remained in focus. Within chips, strength in MU and TSM contrasted with softness in AMD and INTC, reflecting rotation among AI supply-chain names. Higher-beta vehicles like SOXL amplified sector moves; investors should note leverage risks in such products.

02 Other Markets

U.S. 10-year Treasury yield rose by 0.00%, latest at 4.08.

USD/CNH rose 0.0000%, at 6.91; USD/HKD fell 0.0179%, at 7.81.

U.S. Dollar Index fell 0.09%, at 97.70.

WTI crude futures fell 1.29%, at 65.62 USD/bbl; COMEX gold futures rose 1.02%, at 5132.90 USD/oz.

03 Top News

1. NVIDIA expanded enterprise AI software features to enhance GPU utilization. The company recently highlighted improvements aimed at accelerating model deployment in data centers. The enhancements are designed to reduce infrastructure bottlenecks and support higher throughput for customers.

2. Apple introduced new on-device AI capabilities for iPhone to bolster privacy and speed. The update focuses on running select generative tasks locally, reducing cloud dependency. Apple said the move enhances user experience while providing developers with new APIs.

3. Microsoft rolled out additional Copilot tools for enterprise 365 users. The new capabilities aim to automate workflows and summarize content across applications. Microsoft indicated the enhancements may improve productivity and deepen subscription value.

4. Tesla adjusted pricing and incentives for certain vehicle models in select markets. The changes seek to stimulate demand amid evolving competitive dynamics. Analysts noted the move could support deliveries while weighing on near-term margins.

5. Amazon expanded its logistics network with a robotics-enabled fulfillment site. The facility is expected to accelerate delivery times and improve efficiency. Amazon said the site integrates automation to reduce costs and support peak demand periods.

6. Alphabet advanced Gemini integration into core search experiences. The company said the enhancements provide richer answers and new multimodal tools. Advertisers are testing formats that could complement the updated user experience.

7. Oracle announced a cloud partnership with a major healthcare system to modernize workloads. The collaboration aims to migrate critical applications to Oracle’s infrastructure. Oracle expects improved performance and compliance outcomes for the client.

8. Coinbase introduced updates to its Base ecosystem to broaden developer engagement. The changes include tooling upgrades intended to simplify app deployment. Coinbase said increased activity could lift transaction volumes and fee revenue.

9. TSMC increased investments in advanced packaging to support high-performance AI chips. The expansion targets capacity for CoWoS and related technologies. TSMC said the upgrades should alleviate bottlenecks and improve supply for key customers.

10. Micron commenced broader shipments of high-bandwidth memory tailored for AI servers. The company noted ramping production of HBM solutions to meet demand. Micron expects the product mix to improve revenue visibility and margins.

Sources: Reuters, Dow Jones, Tiger Newspress, public market data---Disclaimer: This content is for reference only and does not constitute investment advice.