异动解读|应用材料盘前上涨4.5%,多家投行集中上调目标价叠加半导体设备板块回暖

行情直击
Jul 15

7月15日,应用材料盘前上涨4.5%,报621.92美元/股,成交额1101.55万美元。消息面上,高盛、摩根士丹利、瑞穗及Stifel等多家投行集中将公司目标价上调至630-650美元区间,公司CEO同时释放芯片设备需求长期保持强劲的积极信号,共同增强市场信心。

板块层面,半导体设备板块整体延续反弹态势,同行业阿斯麦涨5.51%、拉姆研究涨4.45%、科磊涨4.37%、泰瑞达涨3.62%,板块回暖为股价提供支撑。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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