异动解读|应用材料夜盘上涨4.44%,半导体设备板块超跌反弹带动修复

行情直击
Jul 06

7月6日,应用材料夜盘上涨4.44%,报626.89美元/股,成交额321.56万美元。此前该股因知名空头伯里公开做空叠加CEO大额减持,连续两个交易日累计大跌约15%,股价从历史高点大幅回落。

消息面上,半导体设备板块整体出现超跌修复行情,同板块个股中拉姆研究涨5.03%、科磊涨5.04%、阿斯麦涨2.86%、泰瑞达涨3.79%。产业资本层面,美光近日启动广岛工厂1.5万亿日元HBM扩建工程,三星与SK海力士十年4.4万亿人民币扩产计划持续推进,设备端实际需求逻辑未发生根本变化,多家投行维持目标价750至900美元区间,市场在急跌后出现技术性买盘回补。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10