Shares of CHINA AEROSPACE (00031) have surged more than 8%. As of writing, the stock is up 8.57% to HK$0.76, with a turnover of HK$19.9636 million.

This movement follows recent investor communications where the company stated it has initiated research and development focused on third-generation semiconductor materials. The company confirmed it currently possesses relevant SiC (silicon carbide) power module products, has mastered corresponding packaging design and process technologies, and has already achieved small-batch shipments. Furthermore, it is actively collaborating with customers on the production and iteration of various SiC power module products, including new types such as those with Miller clamp drivers, isolated drivers, and using zero-voltage turn-off.

Additionally, since the beginning of this year, the company has been actively expanding power module applications in the computing infrastructure sector. Notably, power module products designed for liquid cooling pumps are expected to achieve a business breakthrough within the year.

Public information shows that CHINA AEROSPACE positions itself as the overseas capital operation and industrial integration platform for China's state-owned aerospace enterprises. Its main businesses encompass high-end electronic manufacturing, semiconductor substrates, aerospace services, and new materials. Its technology and industrial operations include the R&D, design, and production of injection-molded products, liquid crystal displays, printed circuit boards, smart chargers, and smart power modules.