6月18日，盛美半导体盘中上涨7.02%，报103.369美元/股，成交额2421.75万美元。
消息面上，SEMI此前发布报告显示，一季度全球半导体设备出货金额同比增长14%，达365.5亿美元，创纪录季度销售额，由持续的AI相关投资驱动，涵盖先进逻辑芯片、DRAM及先进封装产能扩张。盛美半导体作为湿法清洗与电镀设备龙头，高温SPM清洗技术实现突破，可适配GAA、HBM等高端算力芯片量产，海内外先进封装设备订单持续落地，在手订单近170亿元，业绩确定性较强。板块内应用材料涨7.12%，科磊涨6.8%，拉姆研究涨6.5%，阿斯麦涨2.51%。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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