SENASIC x ST，共绘Physical AI 端侧智能芯片新蓝图

SENASIC

May 22

近日，SENASIC琻捷（以下简称“SENASIC”）与全球领先的半导体企业 STMicroelectronics （以下简称“ST”）于中国上海正式签署非约束性合作备忘录。

SENASIC x ST 战略合作签约仪式

聚焦边缘AI智能传感

根据备忘录，双方将结合各自在 MEMS、传感器技术、ASIC 芯片设计及半导体领域的优势，重点围绕性能、功耗和可靠性等关键指标，在芯片设计、集成、封装及系统优化等方面确定合作机遇以及未来的创新路径，共同探索边缘AI智能传感解决方案。

共同定义智能AI电池芯片新未来

SENASIC长期专注于端侧无线智能芯片研发，致力于将无线连接、低功耗设计与边缘 AI 深度融合，推动“每一个传感节点”和“每一颗电芯”实现实时感知、智能分析与协同控制。

SENASIC与ST将共同探索在先进电池监测技术及电池管理系统（BMS）领域的合作机会，应用场景涵盖储能系统（ESS）以及新能源汽车（EV），通过更精准的电池感知、更智能的边缘计算与系统协同，进一步提升电池安全性、智能化水平与系统效率。

SENASIC x ST 签约仪式现场双方合影

未来展望

此次合作备忘录的签署，体现了SENASIC在边缘AI智能传感与电池智能化领域的持续布局，标志着 SENASIC与 STMicroelectronics 在前沿技术方向上建立了更紧密的合作基础。未来，SENASIC将继续携手全球领先合作伙伴，共同推动端侧AI与新能源产业的智能化发展。

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