7月9日，应用材料盘中上涨8.88%，报626.83美元/股，成交额10.77亿美元。消息面上，多家华尔街投行集中上调目标价：道明考恩从525美元大幅上调至700美元，瑞穗从540美元上调至650美元，叠加此前高盛上调至645美元、摩根士丹利上调至647美元，市场共识目标价显著抬升。
与此同时，公司CEO Gary Dickerson表示，主要芯片制造商正分享延伸至2027年以后的产能规划，公司对未来八个季度的客户需求拥有清晰可见性，部分客户甚至提供了至2030年的方向性展望。AI基础设施驱动的半导体设备需求持续扩张，先进封装设备预计将保持行业增速最快领域之一。半导体设备板块整体大幅反弹，拉姆研究涨10.1%、科磊涨9.93%、泰瑞达涨7.82%。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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