戴尔携手三星电子,共建AI驱动半导体制造基础设施

美股速递
May 19

戴尔科技公司正与三星电子有限公司合作,共同构建用于人工智能驱动的半导体制造基础设施。这一合作旨在整合双方在计算硬件与先进半导体制造领域的专长,为下一代芯片生产打造强大的技术底座。此举预示着产业界正加速融合人工智能与尖端制造工艺,以应对日益复杂的芯片设计和高算力需求。

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