6月3日，日月光半导体盘中上涨3.03%，报40.245美元/股，成交额1.12亿美元。消息面上，AMD此前宣布向中国台湾地区半导体与AI产业生态投入超100亿美元，日月光作为核心封测合作伙伴，将与AMD共同开发下一代2.5D桥接互连技术，直接受益于产能扩充与长期订单预期。同时，日月光子公司已研发出业内首条310mm×310mm面板级封装自动化产线，预计明年上半年投产，进一步打开先进封装增长空间。此外，公司封测服务价格已上调5%至20%，先进封装营收目标上调至35亿美元，基本面持续向好。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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