异动解读|应用材料盘中下跌3.59%,加息预期升温叠加半导体设备板块持续承压

行情直击
Sep 01

9月1日,应用材料盘中下跌3.59%,报441.425美元/股,成交额3.32亿美元。

消息面上,美联储官员Walsh近日言论引发加息预期升温,30年期美债收益率此前升至5.3%附近创多年新高,高估值科技板块持续承压。费城半导体指数近期大幅回落,半导体设备板块整体走弱,同业阿斯麦跌1.81%、拉姆研究跌3.3%、科磊跌3.11%、泰瑞达跌5.11%。此外,瑞穗近日下调公司及泛林集团目标价,高管Brice Hill提交出售10000股限制股声明,期权市场此前亦出现多笔方向性看空大单,多重因素叠加压制市场情绪。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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