ASMPT announced that on April 30, 2026, its indirect wholly-owned subsidiary, ASMPT USA Holding, Inc., acting as the seller, along with ASMPT as the seller's ultimate parent company, entered into a share purchase agreement with Applied Materials, Inc., the buyer. Under this agreement, the seller has consented to divest, and the buyer has consented to acquire, all of the common shares of ASMPT NEXX, Inc., a corporation established in Delaware, USA. This transaction constitutes the sale event.

ASMPT NEXX, Inc. is a company incorporated in Delaware. Prior to the completion of the sale, the target company was a direct wholly-owned subsidiary of the seller, which itself is an indirect wholly-owned subsidiary of ASMPT and a member of the group. The target company is a supplier of electrochemical deposition and physical vapor deposition equipment for the advanced packaging of semiconductor devices. It represents a distinct major business line within the group's semiconductor solutions division.

As part of a strategic realignment of its business operations, the group has decided to divest the target company from its semiconductor solutions segment through this sale. This move is intended to allow the group to sharpen its focus on the back-end packaging business. The group believes that under the new ownership, with continued investment and operational synergies, the target company will be better positioned for long-term success. Furthermore, the divestment enables the group to realize the investment value of the target company's operations and reallocate resources in accordance with its strategic priorities.